European Commission
To prepare for the relevant activities in the Chips for Europe Initiative, in the context of the European Chips Act as adopted on 8 February 2022, DG CNECT organised a workshop especially for SMEs on November 22, 2022.
This online workshop focused on the European design platform as well as upcoming funding opportunities that will be made available through the Chips Act.
The design platform, as proposed in the European Chips Act, is a cloud-based virtual environment to be made available across the Union, integrating a wide range of design facilities, from IP libraries to Electronic Design Automation (EDA) tools, as well as support services. The platform will be accessible in an open, non-discriminatory and transparent way, stimulating wide cooperation between users and key actors of the ecosystem whilst reinforcing Europe’s chip design capacity.
Furthermore, a Chips Fund is being set up to provide financial support to semiconductor start-ups and SMEs. This instrument will be implemented through dedicated thematic products by the European Innovation Council and the EIB Group.
All these topics were tackled and discussed with representatives of small and medium companies in Europe during this session.
Agenda
Date: Tuesday 22nd November
Time: 9:30 – 12:30
- Introduction: the Chips Act – Colette Maloney (EC)
- The Chips Fund – Yves Paindaveine (EC)
- EIC Accelerator – Samira Nik (EIC)
- InvestEU equity and Investment process – Nicolas de la Vallee and David Dana (EIF)
- InvestEU debt – Philippe Houett (EIB)
- InvestEU Advisory service – Catherine Bender (EIB)
- Q&A session (all)
- Design Platform – Marco Ceccarelli (EC)
- The Chips Act design platform concept - EC DG Connect
- Panel – Lowering the barrier of entry for design in Europe
- Philippe Notton (SiPearl)
- Romano Hoofman (Imec)
- Loic Lietar (Greenwaves Technologies)
- Fabrizio del Maffeo (Axelera AI)
- Michael Gielda (Antmicro)
- Design platform requirements – open discussion
A video recording is available.
This workshop was organised by the European Commission, DG Connect, Microelectronics Team.